The Printed Circuit Assembler's Guide to Solder Defects
por Indium Corporation
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Sobre o livro
Solder defects in surface-mount technology (SMT) assembly have been an issue for decades. Further, the combined challenges of Pb-free soldering and ever-increasing miniaturization have resulted in new or exacerbated defects in electronics assembly, but there are proven ways to avoid defects.
Indium Corporations’ Christopher Nash and Dr. Ronald C. Lasky address six top defect topics, as well as how to avoid them, including (1) voiding in bottom-termination components, (2) graping, (3) head-in-pillow and non-wet opens, (4) tombstoning of passive components, (5) insufficients, and (6) solder balling and beading.
This book will be especially beneficial to PCB assemblers in improving their assembly processes and the reliability of the end-product, eliminating field failures, and reducing costs.
Indium Corporations’ Christopher Nash and Dr. Ronald C. Lasky address six top defect topics, as well as how to avoid them, including (1) voiding in bottom-termination components, (2) graping, (3) head-in-pillow and non-wet opens, (4) tombstoning of passive components, (5) insufficients, and (6) solder balling and beading.
This book will be especially beneficial to PCB assemblers in improving their assembly processes and the reliability of the end-product, eliminating field failures, and reducing costs.
Características e detalhes
- Categoria principal: Educação
- Categorias adicionais Referências
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Opção de projeto: 15×23 cm
Nº de páginas: 52 -
ISBN
- Capa mole: 9781737023289
- Data de publicação: nov 07, 2021
- Idioma English
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Sobre o autor
IPC Publishing Group, Inc.
Bannockburn, IL
IPC Publishing Group, Inc. dba I-Connect007, is dedicated to educating and informing the electronics interconnect supply chain community with content worth sharing. I-007eBooks was launched in 2017 with a micro eBook "guide to" series. I-007eBooks.com is the library for our main site, I-Connect007.com.